发明名称 |
METHOD FOR MANUFACTURING MODULE WITH PLANAR COIL, AND MODULE WITH PLANAR COIL |
摘要 |
A method for manufacturing a module including a planar coil, and a module including a planar coil, reduce manufacturing cost and also are able to handle a large current. The method for manufacturing the module including the planar coil includes the steps of providing a second resin layer including a magnetic filler on a first resin layer with a built-in chip-type electronic component; providing a planar coil on the second resin layer; and providing a third resin layer including a non-magnetic property so as to coat the planar coil.
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申请公布号 |
US2013002042(A1) |
申请公布日期 |
2013.01.03 |
申请号 |
US201213613023 |
申请日期 |
2012.09.13 |
申请人 |
MURATA MANUFACTURING CO., LTD.;HATASE MINORU |
发明人 |
HATASE MINORU |
分类号 |
H01F38/14;H01F5/00;H01Q7/00;H03H7/01 |
主分类号 |
H01F38/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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