发明名称 METHOD FOR MANUFACTURING MODULE WITH PLANAR COIL, AND MODULE WITH PLANAR COIL
摘要 A method for manufacturing a module including a planar coil, and a module including a planar coil, reduce manufacturing cost and also are able to handle a large current. The method for manufacturing the module including the planar coil includes the steps of providing a second resin layer including a magnetic filler on a first resin layer with a built-in chip-type electronic component; providing a planar coil on the second resin layer; and providing a third resin layer including a non-magnetic property so as to coat the planar coil.
申请公布号 US2013002042(A1) 申请公布日期 2013.01.03
申请号 US201213613023 申请日期 2012.09.13
申请人 MURATA MANUFACTURING CO., LTD.;HATASE MINORU 发明人 HATASE MINORU
分类号 H01F38/14;H01F5/00;H01Q7/00;H03H7/01 主分类号 H01F38/14
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