DIELECTRIC COMPOSITION, MULTILAYERED PRINTED CIRCUIT BOARD COMPRISING DIELECTRIC LAYER MANUFACTURED THEREOF, AND METHOD FOR PREPARING THE MULTILAYERED PRINTED CIRCUIT BOARD

摘要

Disclosed herein are a dielectric composition of a multilayered circuit board including two types of inorganic fillers of 10 to 60 parts by weight with respect to an epoxy resin of 100 parts by weight, a multilayered printed circuit board including a dielectric layer manufactured of the dielectric composition, and a method for preparing the multilayered printed circuit board. According to the present invention, by mixing two types of inorganic fillers such as SiO2 and CaCO3 in manufacturing the dielectric layer of the multilayered circuit board, a high adhesive strength to a plating layer can be achieved without using a fluoride-based solution including 3NH4HF2 as an oxidant while etching the dielectric layer and furthermore, an environmentally hazardous substance can be prevented from being discharged.