发明名称 |
INTEGRATED HEATER ON MEMS CAP FOR WAFER SCALE PACKAGED MEMS SENSORS |
摘要 |
A system and method for controlling temperature of a MEMS sensor are disclosed. In a first aspect, the system comprises a MEMS cap encapsulating the MEMS sensor and a CMOS die vertically arranged to the MEMS cap. The system includes a heater integrated into the MEMS cap. The integrated heater is activated to control the temperature of the MEMS sensor. In a second aspect, the method comprises encapsulating the MEMS sensor with a MEMS cap and coupling a CMOS die to the MEMS cap. The method includes integrating a heater into the MEMS cap. The integrated heater is activated to control the temperature of the MEMS sensor.
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申请公布号 |
US2013001765(A1) |
申请公布日期 |
2013.01.03 |
申请号 |
US201213527497 |
申请日期 |
2012.06.19 |
申请人 |
INVENSENSE, INC.;YARALIOGLU GOKSEN G.;LIM MARTIN |
发明人 |
YARALIOGLU GOKSEN G.;LIM MARTIN |
分类号 |
H01L23/34;H01L21/50 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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