| 摘要 |
An electronic die includes a multi-finger capacitor including a first electrically conductive plate including a plurality of first metal fingers joined together by a first metal base, and a second electrically conductive plate including a plurality of second metal fingers joined together by a second metal base. A dielectric layer is between the first electrically conductive plate and the second electrically conductive plate for electrically isolation. The plurality of first metal fingers and plurality of second metal fingers are interleaved with one another. The die can include a first portion that includes the multi-finger capacitor and a second portion that includes active circuitry configured to provide at least one circuit function, wherein the first and second electrically conductive plates are coupled to the active circuitry.
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