发明名称 THERMOSETTING ADHESIVE SHEET AND FLEXIBLE PRINTED CIRCUIT BOARD
摘要 <p>The purpose of the present invention is to provide a thermosetting adhesive sheet having a thermosetting adhesive agent layer which, after being cured, can achieve excellent adhesiveness and extremely high heat resistance after exposure to humidity and heat. This thermosetting adhesive sheet is characterized by having a thermosetting adhesive agent layer that has a glass transition point in the range from -50°C to 10°C inclusive and a glass transition point in the range from 20°C to 100°C inclusive.</p>
申请公布号 WO2013002001(A1) 申请公布日期 2013.01.03
申请号 WO2012JP64648 申请日期 2012.06.07
申请人 NITTO DENKO CORPORATION;KUWAHARA, RIE;DAIGAKU, NORITSUGU;HORIGUCHI, HAKARU;FURUTA, YOSHIHISA 发明人 KUWAHARA, RIE;DAIGAKU, NORITSUGU;HORIGUCHI, HAKARU;FURUTA, YOSHIHISA
分类号 C09J7/02;C09J133/00;C09J161/04;C09J201/00;H05K1/03 主分类号 C09J7/02
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