WATER-SOLUBLE CUTTING SOLUTION FOR FIXED ABRASIVE WIRE SAW, METHOD FOR CUTTING INGOT USING SAME, METHOD FOR RECYCLING THE SOLUTION, AND WAFER PRODUCED BY CUTTING

摘要

Disclosed are: a water-soluble cutting solution for a fixed abrasive wire saw, which has high cutting performance and can prevent the generation of a hydrogen gas through the reaction between silicon and water; a method for cutting an ingot using the cutting solution; a method for recycling the cutting solution; and a wafer produced by cutting. The water-soluble cutting solution for a fixed abrasive wire saw is characterized by comprising (a) a polyether represented by formula (1), (b) at least one component selected from glycol and a low-molecular-weight glycol ether having a molecular weight of 100 to 300, and (c) water, wherein the content ratio of the component (a) to the component (b) is 1:99 to 50:50 and the content of the component (c) is 5 to 50 wt%. C4H9O(EO)m(AO)nR1 (1) (In the formula, R1 represents a hydrogen atom or an alkyl or alkenyl group having 1 to 8 carbon atoms; EO represents an oxyethylene group; AO represents an oxyalkylene group having 3 to 4 carbon atoms; and m and n are the molar addition numbers and independently represent 1 to 20.)