| 摘要 |
<p>Provided is a sputtering device that reduces etching speed in readily eroded portions and that has a good utilization efficiency of a target. A rectangular magnetic circuit unit (11) mounted on a magnetron cathode (31) is configured so that the oscillation distance is different between a linear unit (111) composed of a rectangular magnet on the long side portion and an end part unit (112) having a magnet on the short side portion. The oscillation distance of the end part unit (112) is greater than that of the linear unit (111) in the X direction parallel to the target-mounting surface.</p> |
