| 摘要 |
Methods and devices for mounting a sensor are presented herein. A temperature sensor assembly for a capacitor bank is disclosed that includes two opposing substrates, and a plurality of contact temperature sensors attached to each substrate. Each temperature sensor is configured to directly contact a surface of one of the capacitor cans in the capacitor bank and therefrom generate a signal indicative of the temperature of the capacitor can. A biasing member attaches the two substrates together. The biasing member is configured to selectively contract, such that the width of the sensor assembly is less than the gap distance between adjacent sets of tandem capacitor cans and the sensor assembly can insert between the sets of capacitor cans, and expand, such that the width of the sensor assembly is greater than the gap distance and the sensor assembly is tensioned against and thereby secured between the sets of capacitor cans.
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