发明名称 Device for Managing Solder Paste
摘要 A device for managing solder paste includes a storage room, a warm up room, a preparing room and a central control device, wherein the storage room, the warm up room and the preparing room respectively have a transportation unit for delivering a solder paste can. There are reading devices disposed respectively at an inlet/outlet of the above rooms for reading information of the solder paste can when the solder paste can passes thereby, and the central control device updates storage information for the solder paste cans. The central control device may access production information of a production line from a production managing system, and thus analyze the mold number and amount of solder paste cans, receive the solder paste cans based on a first-in, first-out manner, and deliver the solder paste cans to the warm up room for the warm up treatment.
申请公布号 US2013004266(A1) 申请公布日期 2013.01.03
申请号 US201113243200 申请日期 2011.09.23
申请人 ASKEY COMPUTER CORPORATION;ASKEY TECHNOLOGY (JIANGSU) LTD.;CHANG SHAO-CHUN;HSIEH CHING-FENG 发明人 CHANG SHAO-CHUN;HSIEH CHING-FENG
分类号 B65G11/06;B65G11/00;B65G11/20 主分类号 B65G11/06
代理机构 代理人
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