发明名称 |
System and Method for Picking and Placement of Chip Dies |
摘要 |
According to an aspect of the invention, there is provided a chip die 2 manipulator apparatus arranged for picking and placing of a chip die 2 in a chip manufacturing process, wherein an imaging system 11 comprising an arc form convex spherical mirror 13 arranged at a second off-axis position B and centered relative to the centre position 5; a folding mirror 4 arranged in a light path between the convex spherical mirror 13 and the centre position 5 for folding the light path to a third off-axis position C; and an arc form concave spherical mirror 15 arranged at the third off-axis position C having a curvature to image from at least one of the centre position 5 and the component 2 on the image detection system 9. The imaging system 11 corrects for the angled image detection of the centre position 5.
|
申请公布号 |
US2013004269(A1) |
申请公布日期 |
2013.01.03 |
申请号 |
US201113520674 |
申请日期 |
2011.01.06 |
申请人 |
NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO;VAN ZWET ERWIN JOHN;VAN DOOREN LEON;VERMEER ADRIANUS JOHANNES PETRUS MARIA;MODDEMEIJER KEES |
发明人 |
VAN ZWET ERWIN JOHN;VAN DOOREN LEON;VERMEER ADRIANUS JOHANNES PETRUS MARIA;MODDEMEIJER KEES |
分类号 |
B25J19/04;B25J11/00 |
主分类号 |
B25J19/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|