发明名称 |
CURABLE RESIN COMPOSITION FOR REFLECTION OF LIGHT, AND OPTICAL SEMICONDUCTOR DEVICE |
摘要 |
Provided is a curable resin composition which enables the production of a cured article having high light reflection performance, having excellent heat resistance and light resistance and high toughness, and rarely reduced in light reflection performance over time. A curable resin composition for reflecting light, characterized by comprising an alicyclic epoxy compound (A), rubber particles (B), a white pigment (C), a curing agent (D) and a curing-accelerating agent (E); or a curable resin composition for reflecting light, characterized by comprising an alicyclic epoxy compound (A), rubber particles (B), a white pigment (C) and a curing catalyst (F). |
申请公布号 |
WO2013002052(A1) |
申请公布日期 |
2013.01.03 |
申请号 |
WO2012JP65488 |
申请日期 |
2012.06.18 |
申请人 |
DAICEL CORPORATION;HIRAKAWA, HIROYUKI;SATO, ATSUSHI |
发明人 |
HIRAKAWA, HIROYUKI;SATO, ATSUSHI |
分类号 |
C08L63/00;C08K3/22;C08L21/00;G02B5/08;H01L23/29;H01L23/31;H01L33/60 |
主分类号 |
C08L63/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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