发明名称 CURABLE RESIN COMPOSITION FOR REFLECTION OF LIGHT, AND OPTICAL SEMICONDUCTOR DEVICE
摘要 Provided is a curable resin composition which enables the production of a cured article having high light reflection performance, having excellent heat resistance and light resistance and high toughness, and rarely reduced in light reflection performance over time. A curable resin composition for reflecting light, characterized by comprising an alicyclic epoxy compound (A), rubber particles (B), a white pigment (C), a curing agent (D) and a curing-accelerating agent (E); or a curable resin composition for reflecting light, characterized by comprising an alicyclic epoxy compound (A), rubber particles (B), a white pigment (C) and a curing catalyst (F).
申请公布号 WO2013002052(A1) 申请公布日期 2013.01.03
申请号 WO2012JP65488 申请日期 2012.06.18
申请人 DAICEL CORPORATION;HIRAKAWA, HIROYUKI;SATO, ATSUSHI 发明人 HIRAKAWA, HIROYUKI;SATO, ATSUSHI
分类号 C08L63/00;C08K3/22;C08L21/00;G02B5/08;H01L23/29;H01L23/31;H01L33/60 主分类号 C08L63/00
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