发明名称 |
ELECTRIC JOINT STRUCTURE AND METHOD FOR PREPARING THE SAME |
摘要 |
Disclosed herein are an electric joint structure including a joint, an intermetallic compound (IMC), and a solder layer, wherein the intermetallic compound (IMC) is generated from an electroless surface treatment plating layer including nickel plating coating of 1 μm or less, a method for preparing the same, and a printed circuit board including the same. The electric joint structure having the intermetallic compound structure according to the exemplary embodiment of the present invention can have a joint structure capable of improving impact resistance by suppressing the generation of a Ni—Sn based intermetallic compound and a P-enriched layer at a solder joint interface during a reflow process and improving workability including the Ni layer before the reflow process.
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申请公布号 |
US2013000967(A1) |
申请公布日期 |
2013.01.03 |
申请号 |
US201213536465 |
申请日期 |
2012.06.28 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD.;LEE DONG JUN;KIM JUNG SUK |
发明人 |
LEE DONG JUN;KIM JUNG SUK |
分类号 |
H01R4/02;B23K1/20;H05K1/11 |
主分类号 |
H01R4/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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