| 摘要 |
Provided is a substrate treating apparatus, which includes a process chamber providing a space in which a substrate is treated, an exhausting pipe connected to the process chamber, and providing a passage through which gas is discharged from the process chamber to an outside thereof, a pump installed on the exhausting pipe, and a valve installed on the exhausting pipe between the process chamber and the pump, and opening and closing the passage. The valve includes a first plate provided with exhausting holes, and a first driver moving the first plate such that the exhausting holes are located within the passage or outside the passage.
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