发明名称 |
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a copper pad surface roughness-treated to have a surface roughness of 0.1 to 1.0 μm pitch period; and an electroless surface treatment plating layer formed on the copper pad. According to the present invention, when the copper pad has a surface roughness of a predetermined pitch period, the electroless surface treatment plating layer formed on the copper pad also has a surface roughness of the predetermined pitch period, thereby having an effect of widening a surface area and improving workability at the time of a wire bonding process for connection with an external device.
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申请公布号 |
US2013000960(A1) |
申请公布日期 |
2013.01.03 |
申请号 |
US201213472299 |
申请日期 |
2012.05.15 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD.;LEE DONG JUN;JEON DONG JU;PANG JUNG YOUN;CHO SEONG MIN;KIM CHI SEONG |
发明人 |
LEE DONG JUN;JEON DONG JU;PANG JUNG YOUN;CHO SEONG MIN;KIM CHI SEONG |
分类号 |
H05K1/09;H05K3/00 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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