| 摘要 |
This is to provide reducing agent composition for a conductive metal paste which improves the pot life of the conductive metal paste and controls fluctuation of a connection resistance value, and a process for preparing the same, and a conductive metal paste. It is a reducing agent composition for a conductive metal paste comprising at least one compound selected from the group consisting of a hydroxyquinoline compound, an aromatic amino alcohol compound, an aromatic amine compound, an anthraquinone compound, an indole compound and an indane compound, and an organic aluminum compound. It is a conductive metal paste comprising the above-mentioned reducing agent composition for a conductive metal paste, metal conductive particles and a resin. It is a method for preparing the reducing agent composition for a conductive metal paste comprising the step of mixing the above-mentioned compound and the organic aluminum compound at a temperature of 5 to 30°C for within 30 minutes. |
