| 发明名称 |
IN SITU-BUILT PIN-GRID ARRAYS FOR CORELESS SUBSTRATES, AND METHODS OF MAKING SAME |
| 摘要 |
A coreless pin-grid array (PGA) substrate includes PGA pins that are integral to the PGA substrate without the use of solder. A process of making the coreless PGA substrate integrates the PGA pins by forming a build-up layer upon the PGA pins such that vias make direct contact to pin heads of the PGA pins. |
| 申请公布号 |
US2013001794(A1) |
申请公布日期 |
2013.01.03 |
| 申请号 |
US201113174109 |
申请日期 |
2011.06.30 |
| 申请人 |
ROY MIHIR K.;MANUSHAROW MATHEW J. |
发明人 |
ROY MIHIR K.;MANUSHAROW MATHEW J. |
| 分类号 |
H01L23/48;H01L21/283 |
主分类号 |
H01L23/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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