PLATING PROCESSING DEVICE, PLATING PROCESSING METHOD, AND RECORDING MEDIUM

摘要

[Problem] To provide a plating processing device that performs a plating process uniformly across the entire surface of a substrate. [Solution] The plating processing device (20) is provided with: a substrate rotating/holding mechanism (110) that holds and rotates a substrate (2); a discharge mechanism (21) that discharges a plating liquid towards the substrate (2) being held at the substrate rotating/holding mechanism (110); and a control mechanism (160) that controls the substrate rotating/holding mechanism (110) and the discharge mechanism (21). The discharge mechanism (21) has: a first nozzle that contains a plurality of discharge openings (41) that are aligned along the radial direction of the substrate (2), or contains a discharge opening (42) that extends along the radial direction of the substrate (2); and a second nozzle (45) that has a discharge opening (46) that can be positioned in a manner so as to approach the center section of the substrate (2) more than the discharge opening(s) of the first nozzle (40).