BUBBLER FOR COMPOUND VAPORIZATION USING CARRIER GAS

摘要

The present invention relates to a fixed bubbler for semiconductor fabrication which vaporizes a compound using the bubbles of carrier gas to form a thin film on the surface of a semiconductor wafer. One embodiment of the present invention discloses a bubbler for compound vaporization using carrier gas having a vessel accommodating reaction material, and comprises: a plate provided at the bottom of a vessel; a first air-diffusing member which is provided at the plate, and radially sprays carrier gas supplied from the outside; a second air-diffusing member which is provided above the first air-diffusing member, and has a plurality of through holes vertically penetrated to allow rising carrier gas to be dispersed and passed; and a third air-diffusing member which is provided above the second air-diffusing member, and is made of porous material to allow rising carrier gas to pass.