发明名称 |
PACKAGE SUBSTRATE HAVING DIE PAD WITH OUTER RAISED PORTION AND INTERIOR RECESSED PORTION |
摘要 |
An electronic assembly includes a substrate including a die pad, where the die pad includes and an outer raised flat portion and a recessed portion that includes an inner recessed portion. A semiconductor die is directly on the outer raised flat portion and affixed to the die pad by a die attach material that is in the inner recessed portion. The die attach material is not on a top surface of the outer raised flat portion.
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申请公布号 |
US2013001760(A1) |
申请公布日期 |
2013.01.03 |
申请号 |
US201113175587 |
申请日期 |
2011.07.01 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED;HO CHIH-CHIEN;JEN SAIHSI;HSIEH ERIC |
发明人 |
HO CHIH-CHIEN;JEN SAIHSI;HSIEH ERIC |
分类号 |
H01L23/495;H01L21/60 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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