发明名称 ALIGNMENT MARKS FOR MULTI-EXPOSURE LITHOGRAPHY
摘要 A plurality of reticles for printing structures in the same lithography level includes an alignment structure pattern within a same relative location in each reticle. Each set of process segmentations in a grating has a reticle segmentation pitch, which is common across all gratings in the plurality of reticles. Within each pair of alignment structure patterns that occupy the same relative location in any two of the plurality of reticles, the process segmentations in one reticle are shifted relative to the process segmentations in the other reticle by a fraction of a reticle segmentation pitch. After printing all patterns in the plurality of reticles, a composite printed process segmentation structure on the substrate includes printed segmentation structures that are spaced by 1/n times the printed segmentation pitch. The pattern for the next level can be aligned to the composite printed process segmentation structure in a single alignment operation.
申请公布号 US2013001193(A1) 申请公布日期 2013.01.03
申请号 US201113170316 申请日期 2011.06.28
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION;GABOR ALLEN H.;MENON VINAYAN C. 发明人 GABOR ALLEN H.;MENON VINAYAN C.
分类号 B44C1/22;G03F1/00 主分类号 B44C1/22
代理机构 代理人
主权项
地址