发明名称 PLASMA TREATMENT DEVICE
摘要 This microwave plasma treatment device has: a power supply rod that is used for applying an RF bias high-frequency wave, and which is connected, at the top of the power supply rod, to a susceptor while connected, at the bottom, to a high-frequency output terminal of a matching box provided inside a matching unit; and a coaxial path that is formed by providing a cylindrical external conductor around the power supply rod serving as an internal conductor. A choking mechanism, which blocks spatial propagation of an unwanted microwave that has entered into the path from a plasma-generating space formed inside a chamber, is provided in the coaxial path so as to block the leakage of the microwave into an RF power supply line in the middle of the line in order to prevent a failure attributable to the leakage of the microwave.
申请公布号 WO2013001833(A1) 申请公布日期 2013.01.03
申请号 WO2012JP04230 申请日期 2012.06.29
申请人 TOKYO ELECTRON LIMITED;IWASAKI, MASAHIDE 发明人 IWASAKI, MASAHIDE
分类号 H01L21/3065;C23C16/511;H01L21/205 主分类号 H01L21/3065
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