发明名称 |
METHODS, APPARATUS, AND SYSTEMS FOR CONTACTING SEMICONDUCTOR DIES THAT ARE ELECTRICALLY COUPLED TO TEST ACCESS INTERFACE POSITIONED IN SCRIBE LINES OF A WAFER |
摘要 |
A semiconductor device includes a first wafer having i) a plurality of semiconductor dies, ii) a plurality of scribe lines adjacent one or more of the semiconductor dies, iii) a test access interface positioned in one or more of the scribe lines, wherein the test access interface has a first plurality of through-substrate conductors with a standardized physical layout, and iv) electrical couplings between at least some of the through-substrate conductors and at least one of the semiconductor dies. Methods, apparatus and systems for testing this and other types of semiconductor devices are also disclosed. |
申请公布号 |
WO2013002806(A1) |
申请公布日期 |
2013.01.03 |
申请号 |
WO2011US42680 |
申请日期 |
2011.06.30 |
申请人 |
ADVANTEST (SINGAPORE) PTE LTD;DIBATTISTA, LARRY JOHN;GURLEY, DUNCAN PACKARD |
发明人 |
DIBATTISTA, LARRY JOHN;GURLEY, DUNCAN PACKARD |
分类号 |
H01L21/66 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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