| 摘要 |
Provided is a multilayer ceramic substrate that has an extremely low resistance of 100 mO or less due to excellent TCR characteristics. Said substrate has a structure that uses lead-out via conductors for resistive films but provides excellent connection reliability between said resistive films and via conductors. The multilayer ceramic substrate (1) is provided with the following: a ceramic body (3) comprising a plurality of ceramic layers (2) laminated together; a resistive element (4) that includes resistive films (5, 6) formed between the ceramic layers (2); and lead-out via conductors (9, 10) that penetrate the ceramic layers (2) in the thickness direction thereof, a first end (11, 12) of each via conductor being connected to one of the resistive films (5). The resistive films and lead-out via conductors contain, for example, nickel and copper, constituting an alloy resistor material. The lead-out via conductors each have a gradient structure wherein the nickel concentration is comparatively high at the first end (11, 12) connected to the resistive film (5) and progressively decreases from said first end (11, 12) towards the opposing second end (13, 14). |
