发明名称 |
PLASMA SPUTTERING PROCESS FOR PRODUCING PARTICLES |
摘要 |
A high production rate plasma sputtering process for producing particles having a size of 10 μm or less is disclosed. The process causes ionization of at least a part of the sputtered target atoms and is performed at such parameters that the pick-up probability of ionized sputtered target atoms on the surface of grains is high. |
申请公布号 |
EP2539480(A1) |
申请公布日期 |
2013.01.02 |
申请号 |
EP20110747794 |
申请日期 |
2011.02.22 |
申请人 |
TIAA AB |
发明人 |
HELMERSSON, ULF;BRENNING, NILS;SOEDERSTROEM, DANIEL |
分类号 |
C23C14/22;B22F9/12;C23C14/34;H01J37/34 |
主分类号 |
C23C14/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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