发明名称 Machine placeable circuit board interposer
摘要 <p>An interposer (30) for connecting two or more circuit boards (22, 26) is a circuit carrying substrate (32) with two or more solder pads (40, 44) on each of two sides (34, 36). Each of the solder pads (40, 44) are connected (42) to an electrically conductive via (38) in the substrate (32), providing electrical interconnection from one side (34) to the other side (36). One or more solder pads (40, 44) have a solder ball (46) on it. The interposer (30) has a contact area (48) suitable for the interposer (30) to be picked up and placed by an automated part placement machine (50). An electrical assembly (20) is made by soldering the solder balls (46) on one side (34) of the interposer (30) to corresponding solder pads (24) on a circuit board (22). The solder balls (46) on the other side (36) of the interposer (30) are likewise soldered to the corresponding solder pads (28) of a second circuit board (26).</p>
申请公布号 EP2542036(A1) 申请公布日期 2013.01.02
申请号 EP20120170952 申请日期 2012.06.06
申请人 DELPHI TECHNOLOGIES, INC. 发明人 VISSER, ROY A.;VADAS, ROBERT L.;GILBERTSON, KURT E.;PEPPLES, MICHAEL J.
分类号 H05K1/11;H05K1/14;H05K3/34;H05K3/36;H05K13/04 主分类号 H05K1/11
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