| 摘要 |
<p>The present invention relates to a plasma processing device capable of positioning a protective member for covering the upper surface of a peripheral edge portion of a substrate, with high accuracy. A plasma processing device 1 has a processing chamber 11, a platen 21 on which a substrate K is placed, a gas supply device 45 supplying a processing gas, a plasma generating device 50 generating plasma from the processing gas, an RF power supply unit 55 supplying RF power to the platen 21, an annular and plate-shaped protective member 31 which is formed in an annular and plate-like shape and is configured to be capable of being placed on a peripheral portion of the platen 21 and which covers the upper surface of a peripheral edge portion of the substrate K with an inner peripheral edge portion thereof when placed on the peripheral portion of the platen 21, support members 35 supporting the protective member 31, and a lifting cylinder 30 lifting up and down the platen 21. At least three first protrusions 33 which are engaged with the peripheral portion of the platen 21 when placed on the platen 21 are formed on a pitch circle on the lower surface of the protective member 31 and the center of the pitch circle is co-axial with the central axis of the protective member 31.</p> |
