摘要 |
Integrated circuits with decoupling capacitor circuitry and manufacturing methods therefor are provided. The decoupling capacitor circuitry (20) includes a decoupling capacitor (100) and density-compliance structures (34). The density-compliance structures may be strapped to metal paths driven by power supply lines (V G , V SS ). Strapping density-compliance dummy structures in this way may increase the capacitance per unit area of the decoupling capacitor circuitry and/or shield the decoupling capacitor from nearby noisy signal sources. |