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发明名称
吸附装置
摘要
本发明系关于一种吸附装置,连接一低气压源,并用以吸附一基板。吸附装置包含一吸附本体及一气压控制装置。吸附本体包含一平面及复数孔洞,其中平面具有一分布范围,并适以与基板接触。该等孔洞系形成于平面上并实质上平均分布于平面之分布范围内。气压控制装置依控制气动连接低气压源与该等孔洞。当基板与平面接触并且气压控制装置气动连接该等孔洞与低气压源时,基板与吸附本体相互稳固。
申请公布号
TWI380943
申请公布日期
2013.01.01
申请号
TW098139474
申请日期
2009.11.20
申请人
孙月卫
发明人
陈瑞玺;孙立璿;曾世明
分类号
B65G47/91;B65G49/06;G02F1/133
主分类号
B65G47/91
代理机构
代理人
陈翠华 台北市松山区南京东路3段261号6楼
主权项
地址
台北市松山区南京东路4段56号12楼之4 TW 12F.-4, NO. 56, SEC. 4, NANJING E. RD., SONGSHAN, TAIPEI CITY 105, TAIWAN, R. O. C.
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