发明名称 Positive resist composition and pattern forming method
摘要 A positive photosensitive composition includes: (A) a resin that has an acid decomposable repeating unit of formula (I) and increases its solubility in an alkali developer by action of an acid; (B) a compound that generates an acid upon irradiation; (C) a resin that has: a fluorine atom and/or a silicon atom; and a group selected from groups (x) to (z); and (D) a solvent: (x) an alkali soluble group, (y) a group which decomposes by action of an alkali developer and increases a solubility of the resin (C) in an alkali developer, and (z) a group which decomposes by action of an acid, wherein, Xa1 represents hydrogen, alkyl, cyano or halogen, Ry1 to Ry3 each independently represents alkyl or cycloalkyl, and at least two of Ry1 to Ry3 may be coupled to form a ring, and Z represents a divalent linking group.
申请公布号 US8343708(B2) 申请公布日期 2013.01.01
申请号 US201113228836 申请日期 2011.09.09
申请人 FUJIFILM CORPORATION;FUKUHARA TOSHIAKI;KANDA HIROMI;KANNA SHINICHI 发明人 FUKUHARA TOSHIAKI;KANDA HIROMI;KANNA SHINICHI
分类号 G03F7/004;G03F7/028;G03F7/039;G03F7/26 主分类号 G03F7/004
代理机构 代理人
主权项
地址