发明名称 Film removing device and film removing method
摘要 A film removing device includes an approach stage having a flat approach part having a surface substantially flush with the surface of a substrate supported on a support member. The flat approach part faces a first side surface of the substrate at a corner of the substrate where the first side surface and a second side surface of the substrate join. A film removing nozzle spouts a solvent toward a peripheral part of the substrate and sucks a solution while being moved along the second side surface and the approach stage. A gas is spouted into a gap between the flat approach part and the corner of the substrate so that the gas flows through the gap toward the second side surface.
申请公布号 US8343284(B2) 申请公布日期 2013.01.01
申请号 US201113163276 申请日期 2011.06.17
申请人 TOKYO ELECTRON LIMITED;KAMEI SHIGENORI;OOISHI KOTARO;HAMADA MASAHITO 发明人 KAMEI SHIGENORI;OOISHI KOTARO;HAMADA MASAHITO
分类号 B08B5/04 主分类号 B08B5/04
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