发明名称 |
Light emitting diode package |
摘要 |
A light emitting diode package includes a mount, a plurality of LED chips, and a first and a second sealants made of different materials. The mount has an accommodation space and at least one partition member to divide the accommodation space into a plurality of separate cavities. The LED chips are placed in the cavities, and emitting beams of the LED chips exiting through the cavities include a first emission with a first wavelength band and a second emission with a second wavelength band, and the second wavelength band is different to the first one. The first and the second sealants are respectively used for sealing at least one of the LED chips placed in at least one of the cavities through which the first or the second emission exits. The first and the second sealants are separate from each other by the partition member.
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申请公布号 |
US8344411(B2) |
申请公布日期 |
2013.01.01 |
申请号 |
US20080194117 |
申请日期 |
2008.08.19 |
申请人 |
YOUNG LIGHTING TECHNOLOGY INC.;CHOU WEI-JEN;WANG SHENG-MIN;YANG CHIAO-CHIH |
发明人 |
CHOU WEI-JEN;WANG SHENG-MIN;YANG CHIAO-CHIH |
分类号 |
H01L29/207;H01L33/56;H01L33/60 |
主分类号 |
H01L29/207 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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