Anticounterfeiting system and method for integrated circuits

摘要

An integrated circuit die comprises a device layer comprising a plurality of semiconductor devices; an interconnect layer comprising a plurality of interconnect paths connecting the semiconductor devices and embedded in a dielectric material; and a plurality of hard nanoparticles embedded in the dielectric material of the interconnect layer, the hard nanoparticles having a hardness greater than a hardness of the dielectric material and of a hardness of the interconnect paths.