发明名称 |
Light emitting diode package having improved wire bonding structure |
摘要 |
An exemplary light emitting diode (LED) package includes a substrate, an LED chip mounted on the substrate, and a wire. The LED chip includes a semiconductor structure and an electrode disposed on the semiconductor structure. The wire electrically connects the electrode of the LED chip to an electrical portion of the substrate. The wire has a first joint and a second joint connected to the substrate. The wire forms a first curved portion between the electrode and the first joint and a second curved portion between the first joint and the second joint.
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申请公布号 |
US8344408(B2) |
申请公布日期 |
2013.01.01 |
申请号 |
US201113149790 |
申请日期 |
2011.05.31 |
申请人 |
ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.;WANG KAI-LUN;HSU SHIH-YUAN |
发明人 |
WANG KAI-LUN;HSU SHIH-YUAN |
分类号 |
H01L33/00;H01L21/00;H01L27/15 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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