Semiconductor device, semiconductor package and wiring structure

摘要

A semiconductor device includes a semiconductor package, a circuit board, an interconnection electrically connecting the semiconductor package and the circuit board, and a wiring structure. The wiring structure includes a through hole, a contact disposed at the through hole and a lead pattern extending from the contact. The wiring structure is disposed between the semiconductor package and the circuit board. The interconnection passes through the through hole and connects with the contact.