Epoxy resin composition for printed wiring board, resin composition varnish, prepreg, metal clad laminate, printed wiring board and multilayer printed wiring board

摘要

An epoxy resin composition for printed wiring board, characterized by containing (A) an epoxy resin component containing an epoxy resin (A-1) having nitrogen and bromine atoms in the same molecule, (B) a phenolic curing agent component containing a phenol resin (B-1), and (C) a curing accelerator component containing an imidazole-silane compound (C-1).