发明名称 |
Method and apparatus for interfacing multiple dies with mapping for source identifier allocation |
摘要 |
A package includes a die and at least one further die. The die has an interface configured to receive a transaction request from the further die via an interconnect and to transmit a response to the transaction request to said further die via the interconnect. The die also has mapping circuitry which is configured to allocate to the received transaction a local source identity information as source identity information, the local source identity information comprising one of a set of reusable local source identity information. This ensures the order of transactions tagged with a same original source identity and target and allows transactions tagged with different source identifiers to be processed out of order.
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申请公布号 |
US8347258(B2) |
申请公布日期 |
2013.01.01 |
申请号 |
US201113028250 |
申请日期 |
2011.02.16 |
申请人 |
STMICROELECTRONICS (GRENOBLE 2) SAS;STMICROELECTRONICS (R&D) LTD.;URZI IGNAZIO ANTONINO;D'AUDIGIER PHILIPPE;SAUVAGE OLIVIER;RYAN STUART;JONES ANDREW MICHAEL |
发明人 |
URZI IGNAZIO ANTONINO;D'AUDIGIER PHILIPPE;SAUVAGE OLIVIER;RYAN STUART;JONES ANDREW MICHAEL |
分类号 |
G06F17/50 |
主分类号 |
G06F17/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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