发明名称 Method and apparatus for interfacing multiple dies with mapping for source identifier allocation
摘要 A package includes a die and at least one further die. The die has an interface configured to receive a transaction request from the further die via an interconnect and to transmit a response to the transaction request to said further die via the interconnect. The die also has mapping circuitry which is configured to allocate to the received transaction a local source identity information as source identity information, the local source identity information comprising one of a set of reusable local source identity information. This ensures the order of transactions tagged with a same original source identity and target and allows transactions tagged with different source identifiers to be processed out of order.
申请公布号 US8347258(B2) 申请公布日期 2013.01.01
申请号 US201113028250 申请日期 2011.02.16
申请人 STMICROELECTRONICS (GRENOBLE 2) SAS;STMICROELECTRONICS (R&D) LTD.;URZI IGNAZIO ANTONINO;D'AUDIGIER PHILIPPE;SAUVAGE OLIVIER;RYAN STUART;JONES ANDREW MICHAEL 发明人 URZI IGNAZIO ANTONINO;D'AUDIGIER PHILIPPE;SAUVAGE OLIVIER;RYAN STUART;JONES ANDREW MICHAEL
分类号 G06F17/50 主分类号 G06F17/50
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