| 发明名称 |
Semiconductor device, LED print head and image-forming apparatus using same, and method of manufacturing semiconductor device |
| 摘要 |
In a method of manufacturing a semiconductor thin film piece device, a plurality of semiconductor thin film pieces (14) are selected from among the semiconductor thin film pieces (14) formed on a first substrate (35), and bonded to a first set of predetermined area on a second substrate (12). Subsequently, a plurality of semiconductor thin film pieces are selected from the remaining semiconductor thin film pieces (14), and bonded to a second set of predetermined area.
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| 申请公布号 |
US8343848(B2) |
申请公布日期 |
2013.01.01 |
| 申请号 |
US20080165699 |
申请日期 |
2008.07.01 |
| 申请人 |
OKI DATA CORPORATION;OGIHARA MITSUHIKO;FUJIWARA HIROYUKI;ABIKO ICHIMATSU;SAKUTA MASAAKI |
发明人 |
OGIHARA MITSUHIKO;FUJIWARA HIROYUKI;ABIKO ICHIMATSU;SAKUTA MASAAKI |
| 分类号 |
H01L21/30;B41J2/45;H01L21/48;H01L21/50;H01L21/60;H01L21/98;H01L25/075;H01L33/44;H01L33/48;H01L33/58 |
主分类号 |
H01L21/30 |
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