Light emitting diode device, manufacturing method of the light emitting diode device and mounting structure of the light emitting diode device

摘要

The embodiment of the present invention provides an LED device, a manufacturing method of the LED device and a mounting structure of the LED device. In order to manufacture the LED device with low manufacturing cost through simple process capable of overcoming thermal fatigue due to heat generation, breaking of wire due to mechanical stress, the method comprises etching a wafer; forming a conductive metal layer from an upper surface to a lower surface of the wafer; bonding a light emitting diode chip to the metal layer which is disposed on the upper surface of the wafer; filling a resin into a space over the light emitting diode chip; and forming an electrode pad on the metal layer which is disposed on the lower surface of the wafer.