发明名称 |
Semiconductor device and manufacturing method thereof |
摘要 |
A semiconductor device of the invention includes: a substrate having a hollowed hollow section on a top surface; a semiconductor chip mounted in the hollow section of the substrate; and a lid having a substantially plate-shaped top plate section that opposes the substrate and covers the hollow section, and having at least one pair of side wall sections that project from a circumference of the top plate section towards the substrate and that engage with a side surface of the substrate. The substrate and the lid can be accurately positioned.
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申请公布号 |
US8344489(B2) |
申请公布日期 |
2013.01.01 |
申请号 |
US20090628127 |
申请日期 |
2009.11.30 |
申请人 |
YAMAHA CORPORATION;SAITOH HIROSHI;SUZUKI TOSHIHISA;SAKAKIBARA SHINGO |
发明人 |
SAITOH HIROSHI;SUZUKI TOSHIHISA;SAKAKIBARA SHINGO |
分类号 |
H01L23/02 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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