发明名称 Modular input/output bridge system for semiconductor processing equipment
摘要 Apparatus and methods for providing an interface for a semiconductor processing tool are provided. In some embodiments, the apparatus may include an input/output bridge for receiving analog and state command system control signals from, and sending return data and status information to, a system controller, wherein the analog and state command system control signals are intended to control an analog device, and for converting the analog and state command system control signal into a digital system control signal intended to control a digital device; and an upper pneumatic assembly coupled to the input/output bridge for providing pressure control to one or more pressure zones located on a polishing apparatus coupled to the upper pneumatic assembly for the polishing of semiconductor wafers.
申请公布号 US8346980(B2) 申请公布日期 2013.01.01
申请号 US20100775258 申请日期 2010.05.06
申请人 APPLIED MATERIALS, INC.;SCHAUER RONALD VERN 发明人 SCHAUER RONALD VERN
分类号 G06F3/00;H01L21/00 主分类号 G06F3/00
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