发明名称 |
Interface structure for copper-copper peeling integrity |
摘要 |
An integrated circuit device is disclosed. An exemplary integrated circuit device includes a first copper layer, a second copper layer, and an interface between the first and second copper layers. The interface includes a flat zone interface region and an intergrowth interface region, wherein the flat zone interface region is less than or equal to 50% of the interface.
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申请公布号 |
US8344506(B2) |
申请公布日期 |
2013.01.01 |
申请号 |
US20090633499 |
申请日期 |
2009.12.08 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.;LIN CHENG-CHUNG;LIU CHUNG-SHI;YU CHEN-HUA |
发明人 |
LIN CHENG-CHUNG;LIU CHUNG-SHI;YU CHEN-HUA |
分类号 |
H01L23/50 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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