HEAT TREATMENT FURNACE AND HEAT TREATMENT APPARATUS

摘要

PURPOSE: A thermal processing furnace and a thermal processing apparatus are provided to uniformly heat a wafer by arranging a heater element on the inner surface of an insulation material. CONSTITUTION: A processing container receives one or more objects. A cylindrical insulation material(16) covers the circumferences of the processing container. A heater is arranged along the inner surface of the insulation material and includes a band-shaped heater element(18) of a core gate type arranged along the inner surface of the insulation material. The heater element has a valley protruding to the outside and a ridge protruding to the inside.