| 摘要 |
<p>A WAFER-PROCESSING TAPE (10), HAVING AN INTERMEDIATE RESIN LAYER (2), A REMOVABLE ADHESIVE LAYER (3), AND, IF NECESSARY, AN ADHESIVE LAYER (4), WHICH ARE LAMINATED IN THIS ORDER ON A SUBSTRATE FILM (1), WHEREIN A STORAGE ELASTIC MODULUS AT 80°C OF THE INTERMEDIATE RESIN LAYER IS LARGER THAN A STORAGE ELASTIC MODULUS AT 80°C OF THE REMOVABLE ADHESIVE LAYER.</p> |
