ANISOTROPIC ELECTROCONDUCTIVE MATERIAL, CONNECTION STRUCTURE, AND PROCESS FOR PRODUCING THE CONNECTION STRUCTURE

摘要

An anisotropic conductive material prevents conduction resistance from varying among bumps or among linear terminals when connecting an IC chip or a flexible wire to a wiring board via the anisotropic conductive material. The anisotropic conductive material is formed by dispersing conductive particles in an insulating binder. The minimum melt viscosity [&eegr;0] thereof is in a range of from 1×102 to 1×106 mPa·sec, and satisfies the following equation (1): 1<[&eegr;1]/[&eegr;0]≦̸3  (1) where in the equation (1), [&eegr;0] represents the minimum melt viscosity of the anisotropic conductive material, and [&eegr;1] represents a melt viscosity at a temperature T1 which is 30° C. lower than a temperature T0 at which the minimum melt viscosity is exhibited.