发明名称 METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
摘要 PURPOSE: A PCB(printed circuit board) manufacturing method is provided to prevent the occurrence of faulty parts by plating a metal with a pad and an input and output terminal. CONSTITUTION: An adhesive(150) sticks a component(100) on a cooper film(200). An insulation layer surrounds the component. The component is mounted on a base layer. The base layer or the copper film is connected to an input and output terminal of the component. The insulation layer and the cooper film are gradually laminated.
申请公布号 KR101216414(B1) 申请公布日期 2012.12.28
申请号 KR20110064670 申请日期 2011.06.30
申请人 APERIO CO., LTD. 发明人 PARK, JAE HYUN;JUNG, YEON KYUNG
分类号 H05K3/46;H05K1/18 主分类号 H05K3/46
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