发明名称 |
METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD |
摘要 |
PURPOSE: A PCB(printed circuit board) manufacturing method is provided to prevent the occurrence of faulty parts by plating a metal with a pad and an input and output terminal. CONSTITUTION: An adhesive(150) sticks a component(100) on a cooper film(200). An insulation layer surrounds the component. The component is mounted on a base layer. The base layer or the copper film is connected to an input and output terminal of the component. The insulation layer and the cooper film are gradually laminated.
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申请公布号 |
KR101216414(B1) |
申请公布日期 |
2012.12.28 |
申请号 |
KR20110064670 |
申请日期 |
2011.06.30 |
申请人 |
APERIO CO., LTD. |
发明人 |
PARK, JAE HYUN;JUNG, YEON KYUNG |
分类号 |
H05K3/46;H05K1/18 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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