| 摘要 |
Disclosed are methods and apparatuses for cooling a work piece surface using a dual-loop cooling system. The system includes a vapor-compression loop and a liquid-evaporation loop. The loops are configured to prepare a coolant at or approximately at saturation for delivery into a chamber for cooling the surface. A preferred liquid-evaporation loop includes a chamber, a phase separator, a liquid pressurizer, and a vapor mixer that heats the coolant to or near its saturation temperature. A preferred vapor-compression loop includes the phase separator, a compressor, a condenser, an expansion valve, and a return line. The vapor mixer preferably heats the coolant by mixing liquid coolant with vapor coolant derived from the vapor-compression loop. A two-phase flow detector may be disposed downstream of the vapor mixer and be in communication with a vapor valve disposed upstream of the vapor mixer to ensure that an appropriate amount of vapor is fed into the vapor mixer to induce evaporation. Methods include cooling a surface by cycling a coolant through the liquid-evaporation loop and preparing the coolant at saturation with vapor derived from the vapor-compression loop. |
