TEMPORARY FIXING COMPOSITION

摘要

[Problem] To provide a temporary fixing composition that is capable of fixing wafers, and the like, or metals with high adhesive strength, and which allows wafers, and the like, or metals to be simply and cleanly separated without damage. [Solution] This temporary fixing composition contains the following components (A) to (C): component (A), a thermoplastic resin polymerized from only a-olefins with 16 to 35 carbons; component (B), a hydrogenated tackifier; and component (C), a hydrocarbon compound that is solid at 25°C. Moreover, the temporary fixing composition has a melt viscosity of 1 to 5000 mPa·s at 100°C, a Shore D hardness of 30 to 100, and is used for surface grinding.