| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which semiconductor members are firmly bonded to each other, an electronic appliance, and a manufacturing method for the semiconductor device. <P>SOLUTION: A first wire layer 2 to be bonded to a second wire layer 9 includes: a first interlayer insulation film 3; a first electrode pad 4 embedded in the first interlayer insulation film 3 and having one surface positioned on the same plane as a surface of the first interlayer insulation film 3; and a first dummy electrode 5 having one surface positioned on the same plane as the surface of the first interlayer insulation film 3 and disposed around the first electrode pad 4. The second wire layer 9 includes: a second interlayer insulation film 6 positioned on a side of the first interlayer insulation film 3 that faces the first electrode pad 4; a second electrode pad 7 having one surface positioned on the same surface as a surface of the second interlayer insulation film 6 on the first interlayer insulation film 3 side and bonded to the first electrode pad 4; and a second dummy electrode 8 having one surface positioned on the same plane as the surface of the second interlayer insulation film 6 on the first interlayer insulation film 3 side, disposed around the second electrode pad 7, and bonded to the first dummy electrode 5. <P>COPYRIGHT: (C)2013,JPO&INPIT |
