| 发明名称 |
LED ENCAPSULATION RESIN BODY, LED DEVICE, AND METHOD FOR MANUFACTURING LED DEVICE |
| 摘要 |
An LED encapsulation resin body disclosed in the present application includes: a phosphor; a heat resistance material arranged on, or in the vicinity of, a surface of the phosphor; and a silicone resin in which the phosphor with the heat resistance material arranged thereon is dispersed.
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| 申请公布号 |
US2012326197(A1) |
申请公布日期 |
2012.12.27 |
| 申请号 |
US201213599057 |
申请日期 |
2012.08.30 |
| 申请人 |
PANASONIC CORPORATION |
发明人 |
OHBAYASHI TAKASHI;SHIRAISHI SEIGO |
| 分类号 |
H01L33/52;H01L33/44 |
主分类号 |
H01L33/52 |
| 代理机构 |
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代理人 |
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