PLASTIC PACKAGED CHIP AND MANUFACTURING METHOD THEREOF

摘要

Provided are a plastic packaged chip and a manufacturing method thereof. The plastic packaged chip comprises: a plastic packaging material (11) and a heat sink (12). An edge of the plastic packaging material (11) is provided with an accommodation groove (111). The accommodation groove (111) is used to accommodate the heat sink (12). The chip can solve the problem that the heat dissipation effect of the plastic packaged chip is affected since the heat sink occupies a large chip space, and under the premise of ensuring the good heat dissipation effect of the chip, the structure is simple and reliable, is easy to be implemented, and can save the chip space.